The JLY BST-1023APLUS repair jig holds the motherboard in place during iPhone repairs and helps position it precisely. Its double-sided design supports more compatible models, while the strong magnet helps position the stencils for BGA reballing.
- Type: Motherboard repair jig
- Design: Double-sided
- Material: Aluminum alloy and steel
- Magnet: Strong
- Jig dimensions: 121 × 71 × 10 mm
- Metal mesh dimensions: 112 × 62 × 0.1 mm
- Weight: 170 g
- Compatibility: iPhone 12, 12 Pro, 12 Pro Max, IPX, XS, XS Max, 11, 11 Pro, and 11 Pro Max
- Package contents: Motherboard holder, 8 BGA reballing stencils
Manufacturer
OEM- Type
- Repairing Pads
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.