UD motherboards enhance DDR5 memory performance and offer top-tier compatibility using various advanced methods.

Automatic CPU & DDR5 Memory Boost

With a single click, unleash the full potential of your CPU & DDR5 memory, instantly enhancing your gaming and work performance.

One-Click Acceleration:

Improve CPU & DDR5 speeds with just one click.

• Real-time Analysis
• OC UP Accuracy
• EZ to Pro

Enhanced Computing Power

• Accelerated AI Decision-Making
• Enhanced Reinforcement Learning
• Improved Language Processing

• Custom Overclocking for your CPU and Memory
• Faster Data Transfer and Application Loading
• Improved Multitasking Performance
• Optimized Overall System Performance

Maximize Performance in an Instant

Allow users to easily become overclocking experts through a simple interface.

EZ to Peak

Smart & Safe Overclocking

Protect your motherboard through multiple safeguards against overheating and overcurrent.

• OTP: Temperature Protection
• OCP: Overcurrent Protection
• OVP: Overvoltage Protection
• OPP: Overpower Protection
• UVP: Undervoltage Protection
• SCP: Short Circuit Protection

Lower Power Usage - Optimal Power Performance

Boost up to 3% CP/Per Watt*

With faster computations, it also means reduced power consumption, making it more environmentally friendly and energy-efficient, continuously contributing to the well-being of our planet.

The AI model, trained by AI TOP on various overclocking datasets, improves accuracy and stability while optimizing performance. This model serves as the core of the AORUS AI Snatch software.

• OC up to 20% higher speed
• OC Efficiency UP
• No more trial and error
• Optimal performance-stability balance.

AI Flowchart

Data Augmentation

• Expands data size
• Reduces the risk of overfitting
• Simulates more realistic conditions

Accurate dataset

AI-based Overclocking Analysis

• Overclocking parameter list
• Creation of OC feature weights and correlation table
• Creation of thermal correlation map
• Critical features identified

AI-based PCB technology uses AI algorithms to optimize vias, routing, and stackups. It ensures top performance and signal integrity in both single and cross-layer throughout the design process.

• AI-ViaFusion Technology

  Optimized vias & pads for signal integrity

• AI-Trace Technology

  Smart routing for maximum performance

• AI-Layer Technology

  Customized stacks for enhanced functionality

Key Features:

AI-generated design recipes
Artificial intelligence simulation
Signal verification powered by artificial intelligence
Single and multi-layer signal optimization

AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity

Signal reflection reduction Up to 28.2%
AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances multi-layer signal integrity and transmission performance, surpassing traditional design methods.

Best-in-class signal quality

• Superior signal transmission performance
• Significantly reduced signal reflection
• Increased signal quality and reliability
• Improved multi-layer PCB signal performance

AI-ViaFusion Technology - AI-Engineered Via Design Formula

AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to improve high-speed signal transmission.

• Optimized via design

  Varies according to sizes for optimized signal and power paths

• Pad-Driven Optimization

  Customized pad sizes for performance and production balance

• Precision complex impedance matching

  Selected via & pad sizes for optimal signal impedance

Unlock AI-supported performance with AI-ViaFusion technology

• Minimized insertion loss

  Optimized vias reduce signal loss

• Enhanced return loss

  Precision complex impedance matching reduces reflections

• Optimized eye diagram

  The wider eye opening enhances signal integrity

* Eye Diagram: A signal quality evaluation tool in digital communications. It overlays bit cycle waveforms into a pattern resembling an eye. A larger, cleaner opening indicates better signal quality and transmission reliability.

AI-ViaFusion Technology - AI-Driven Revolution in PCB Design

Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.

AI-ViaFusion technology optimizes PCB performance through:

• Strategic Via Sizing

  Optimized for diverse signals across the PCB

• Enhanced impedance matching

  Precise control via machine learning

• Space optimization

  Maximized layout efficiency with signal integrity

AI-Trace Technology - Revolutionary AI PCB Routing

AI-Trace technology transforms PCB design by leveraging artificial intelligence to optimize trace routing, resulting in improved performance and signal integrity.

• Mitigation of fiber weave effect

  Optimized signal timing

• Shielded memory routing

  Optimized signal shielding and accuracy

• Optimized impedance topology

  Refined traces with minimal resistance

• Isolated memory routing

  Optimized trace layout and layer separation

• Daisy-Chained Routing

  Innovative design eliminates signal congestion points

Enjoy next-generation PCB routing with GIGABYTE's AI-Trace technology.

Mitigating Fiber Weave Impact with AI-Trace Technology

The fiber weave effect in high-speed PCBs arises from varying dielectric constants of epoxy resin and glass fibers, causing diverse signal propagation speeds, leading to signal integrity issues such as coupling and jitter. AI-Trace technology applies innovative routing angles to mitigate this effect.

Benefits of mitigation:

• Reduces signal distortion
• Improves transmission reliability
• Supports higher data rates
• Enhances overall system stability

AI-Layer Technology - Next-Generation Multi-Layer PCB Design

AI-Layer technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.

Core innovation:
AI-optimized customized layer design

• AI-optimized layer design
• Unique material for each layer
• AI-verified signal integrity
• Customized PCB for maximum performance

Key Features:

• PCB layer optimized with artificial intelligence and design material Enhanced 2X copper technology
• Server-grade low-loss PCB

(* Low loss only for the 8-layer PCB model)

• Supports Intel® Core™ Ultra processors (2nd Series)
• 8+1+2 phase hybrid VRM solution
• D5 Bionic Corsa for infinite memory performance
• AI Perfdrive : Provides optimal and customized preset BIOS profile for users
• EZ-Latch : PCIe x16 slot with quick release design
• User-friendly interface : Multi-Theme, AIO Fan Control, and Q-Flash Auto Scan in BIOS and SW
• Ultra-fast storage : 2*M.2 slots, including 1* PCIe 5.0 x4
• M.2 Thermal Guard : To ensure M.2 SSD performance
• Fast networking : 2.5 GbE LAN
• Extensive connectivity : DisplayPort, HDMI