The AGT-134 thermal pad by Termopasty transfers heat in places where thermal paste cannot be applied. Its flexible, compressible design conforms to the components that need cooling.
The thermal pad can be placed between heat-generating semiconductors and a heatsink. It can also fill air gaps between a computer motherboard and a heatsink, or be used in LED lighting systems.
- Type: Thermal pad
- Dimensions: 20 × 130 × 1 mm
- Thermal conductivity: 1.5 W/mK
- Quantity: 1
Main Specifications
- Type
- Thermal Pad
Thermal Pad Dimension
- Length
- 130 mm
- Width
- 20 mm
- Thickness
- 1 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.