AG Thermally Conductive Glue TermoGlue - a great way to secure heat sinks, e.g., memory chips, transistors, or bridges. The connection created is extremely strong and has excellent heat transfer characteristics.
- Color: white
- Surface drying time: [25 °C, minutes] 2-8
- Hardness: 45-75
- Tensile strength: 2.0 Mpa
- Elongation: 100%
- Thermal conductivity: > 1.0 W / mK
- Volume resistance: < 2.0 x 10 ^ 15 c-in / W
- Dielectric strength: 20 KV / mm
- Dielectric loss factor (60Hz): 0.003
- Operating temperature: 200 °C
Dimensions
- Form
- Paste
- Epoxy
- No
- 2-Component
- No
- Packaging Type
- Tube
- High Temperature
- No
- Colour
- White
- Pieces
- 1 pcs
Capacity
- Quantity
- 10 ml
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.