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The Nedis HSPA01I thermal paste is a silicone compound for use on CPUs and GPUs, as well as computer heatsinks. It has a thermal conductivity greater than 3.2 W/m·K and a thermal resistance of less than 0.06 °C·in²/W.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.
